VTAP25 Recommendations for PCB layout

Module dimensions

The module dimensions are 24mm x 29.3mm x 5.9mm (0.95in x 1.15in x 0.23in).

External dimensions of a VTAP25-MOD reader module

Please contact vtap‑support@dotorigin.com for 3D model of the module.

Holes for test pads

To facilitate user tuning, there are six pads on the bottom of the module. The host board must accommodate for these holes for future accessibility. These pads connect to the antenna drive pins on the NFC controller to allow connecting a VNA for tuning purposes and to the receive pins and test-bus pins for future validation. See the VTAP25 footprint for the test pad dimensions.

Test points on a VTAP25-MOD reader module

Footprint

All dimensions are in mm.

Footprint of a VTAP25-MOD reader module

Soldering

Solder the module in a single reflow. Use the lead-free alloy Sn96.5Ag3Cu0.5, also known as the SAC305.

Solder reflow diagram for a VTAP25-MOD reader module

The VTAP25 is rated at the moisture sensitivity level (MSL) of 3. Once the module is unpacked from the sealed bags, it must be soldered within 168 hours under the factory conditions 25 ± 5°C and 60 %RH. If not soldered within this time period, the module needs to be baked before soldering.